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We proposed an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 μm × 240 μm × 75 μm) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temperature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.
References :
Eiji Iwase, Hiroaki Onoe, Akihito Nakai, Kiyoshi Matsumoto, Isao Shimoyama, “Temperature-Controlled Transfer and Self-Wiring for Multi-Color LED Display on a Flexible Substrate,” The 22nd IEEE International Conference on Micro Electro Mechanical Systems (MEMS '09), pp. 176-179, Sorrento, Italy, January 25-29, 2009. [Proceedings]
Hiroaki Onoe, Akihito Nakai, Eiji Iwase, Kiyoshi Matsumoto, Isao Shimoyama, “Temperature-Controlled Transfer and Self-Wiring for Multi-Color LED Arrays,” Journal of Micromechanics and Microengineering, vol. 19, no. 7, Art. No. 075015, 2009. [Paper] |