This research reports on a method of carbon nanotubes (CNTs) placement on a silicon wafer by stamping transfer for integration of specified CNTs onto specified positions. CNTs which directly synthesized between the gaps of silicon microstructures were picked up by a polydimethylsiloxane (PDMS) stamp sheet and placed on a silicon wafer. Raman spectroscopy revealed that the placed CNTs had little defect on their surface condition. From the measurement of the current-voltage characteristics, we verified that the CNTs placed on the electrode were electrically connected to the electrode.